EKF - Short Profile
EKF - Short Profile
ECX-PCIE

CompactPCI® Serial to CompactPCI® Express System Slot Backplane Coupler

Mezzanine Side Card for CompactPCI® Serial CPU Boards



ECX-PCIE

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ECX-PCIE

CompactPCI® Serial to CompactPCI® Express Backplane Coupler

NVMe & SATA SSD Mass Storage • USB 3.0 & Gigabit Ethernet Front I/O


The ECX-PCIE is a mezzanine side card for EKF CompactPCI® Serial CPU boards, equipped with a PCIe® Gen3 packet switch, on-board NVMe and SATA mass storage, and high speed front I/O.

The PCI Express® switch supports a CompactPCI® Express (aka PXI Express™) backplane with four links organized as Gen3 x4, thereby replacing a CompactPCI® Express CPU card. This enables a hybrid system which is comprised of two backplanes, CompactPCI® Serial boards to the left, and CompactPCI® Express peripheral cards to the right. The CompactPCI® Serial CPU controls also the CompactPCI® Express backplane via the ECX-PCIE mezzanine card.

The ECX-PCIE is suitable for EKF CPU carrier cards such as the SC5-FESTIVAL, with support for 8 x PCIe® lanes on a mezzanine board.


The CPU carrier board and ECX-PCIE side card assembly requires 10HP common front panel width, and must be inserted into the particular system slots of two adjacent backplanes. While the CPU card fits into a CompactPCI® Serial backplane which has its system slot right aligned, the ECX-PCIE meets the left aligned system slot of the neighbouring CompactPCI® Express backplane.

In addition, the ECX-PCIE is provided with an M.2 socket for an NVMe (PCIe®) or SATA SSD module. Another socket is suitable for either a PCIe® Mini Card, or mSATA SSD. Furthermore, the ECX-PCIE is equipped with three GbE and three USB 3.0 ports for front I/O, which expands the native CPU carrier card I/O. As an option, the front panel can be provided with SMA antenna connectors for WWAN or WLAN operation.


ECX-PCIE • Multifunction CPU Mezzanine Side Card

ECX-PCIE (10HP Assembly w. CPU)

Feature Summary

  General
  • Mixed function mezzanine side card for EKF CompactPCI® Serial CPU boards
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • PICMG® CompactPCI® Express (EXP.0) system slot card
  • Based on new mezzanine connectors HSE1/HSE2 (8 x PCIe® Gen3)
  • Suitable e.g. for use with CPU cards SC4-CONCERTO, SC5-FESTIVAL, SC9-TOCCATA
  • 10HP assembly together with CPU card
  • 24-lanes PCI® Express Gen3 switch
  • Supports CompactPCI® Express backplane
  • Provides Gigabit Ethernet front panel I/O (3 x RJ45)
  • Provides USB 3.0 front panel I/O (3 x Type A)
  • Provides mass storage capability (1 x M.2 NVMe/SATA, 1 x mSATA)

  Backplane Connectors
  • CompactPCI® Express backplane connectors XP1, XJ2, XJ3, XJ4, system board pin assignment
  • PCI® Express support four links Gen3 x4
  • Can be used with any standard CompactPCIŽ Express backplane (system slot left aligned)
  • Four links Gen2 x1 (available on peripheral slots 4, 6, 7, 8)
  • 6HP pitch between system slots CPCI® Serial and CPCI® Express

  PCI Express® Switching
  • 24-lane 6-port PCI Express® Gen3 packet switch PEX 8724
  • Upstream 1 x4 link wired to the HSE1 mezzanine connector (CPU card PCH or processor)
  • Downstream 4 x4 links to the CompactPCI® Express backplane
  • Downstream 1 x4 link to the NVMe SSD M.2 socket

  Front Panel I/O
  • 3 x RJ45 Gigabit Ethernet jacks, three individual on-board I210-IT controllers
  • 1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate
  • 3 x USB 3.0 (3.1 Gen1) Type A receptacles
  • Two USB ports via on-Board USB controller, one USB port derived from HSE1 mezzanine connector

  Networking
  • Three individual networking interface controllers (NIC), based on PCI Express®
  • 1000BASE-T, 100BASE-TX, 10BASE-T connections
  • Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
  • IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
  • IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensitive streams (TSN)
  • IEEE 1588 and 802.1AS packets time stamping for high-precision time synchronization
  • All GbE ports wired via RJ45 front panel connectors

  USB
  • Upper front panel receptacle wired to HSE1 mezzanine connector (CPU carrier card PCH)
  • Middle and lower connectors wired to PCI Express® dual port USB 3.0 controller TUSB7320
  • USB 3.1 Gen1 (formerly USB 3.0) xHCI (eXtensible host controller interface) SuperSpeed supported
  • USB 2.0 high-speed, full-speed, low-speed supported
  • 3 x front panel Type-A USB 3.0 host connectors
  • VBUS (+5V) 1.5A high current power switches assigned to front panel connectors

  Mass Storage Solutions
  • M.2 (formerly known as NGFF) socket for an NVMe type SSD module up to 2280 size
  • PCI Express® Gen3 x4 interface (M-key socket)
  • Socket height 4.2H (double sided module allowed)
  • Capacity up to 2TB as of current
  • Suitable for operating system installation (boot device)
  • Alternate usage with an SATA type SSD B-M key
  • Autosensing analog switch for selection between PCIe® and SATA operation
  • On-Board 6G SATA controller 88SE9170
  • PCI Express® Mini Card socket, full-size or half-size modules
  • PCI Express® Mini Cards of all styles supported: USB 2.0 and PCIe® based, and mSATA
  • Autosensing analog switch for selection between PCIe® and SATA operation
  • On-Board 6G SATA controller 88SE9170
  • Suitable for wireless applications e.g. WLAN, Bluetooth or 2G/3G/LTE modem card
  • Micro SIM card holder associated (15mm x 12mm ETSI TS 102 221 V9.0.0, Mini-UICC)
  • Suitable for fieldbus modules e.g. CAN-FD, and industrial Ethernet modules (real time networking)
  • Custom specific F/P design for additional pigtail SMB antenna connectors (10HP front or wider)
  • Custom specific F/P design for non-radio applications e.g. CAN-FD (10HP or wider)

  Applications
  • System expansion with CompactPCI® Express peripheral cards
  • Supports PCI Express® on up to four CompactPCI® Express peripheral slots (4x4 Gen3)
  • Replaces CompactPCI® Express CPU card - entire system control by affordable CompactPCI® Serial CPU
  • Enables usage of CompactPCI® Express boards in a CompactPCI® Serial system
  • Demanding test and measurement systems

  Regulation & Environmental
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management
  • Custom specific development on request
  • Long term availability
  • Coating, sealing, underfilling on request
  • RoHS compliant 2002/95/EC
  • Operating temperature -40°C to +85°C (industrial temperature range)
  • Storage temperature: -40°C to +85°C, max. gradient 5°C/min
  • Humidity 5% ... 95% RH non condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
  • MTBF 23.7 years

ECX-PCIE • Simplified Block Diagram

ECX-PCIE • Simplified Block Diagram
Ordering Information
Please refer to List 23 for popular SKUs