EKF - Short Profile
EKF - Short Profile
SPY-RIG

WWAN Module Carrier • CompactPCI® Serial

4 x M.2 Sockets • 4 x Soldered Modules



SPY-RIG

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SPY-RIG

CompactPCI® Serial • Octal WWAN Module Carrier

4 x M.2 Sockets • 4 x Soldered Modules


The SPY-RIG is a peripheral slot card for CompactPCI® Serial systems. The board serves as a carrier for up to eight WWAN modules, e.g. 3G or 4G (LTE) modems, and also forthcoming technologies beyond 4G. Four M.2 sockets are provided to accommodate M.2 3042 style modules, related to front panel Mini SIM card slots. Another four WWAN modules are directly soldered to the PCB, combined w. on-board Micro SIM card sockets.

The module antenna I/Os are strapped to an on-board 8:1 R/F combiner circuit, which has its sum port wired to the SMA type front panel antenna connector, for minimum external antenna cabling effort. The M.2 sockets support USB2 and USB3 based WWAN 3G/4G (LTE) and future modules. The soldered 3G modems are USB2 controlled. The SPY-RIG is well suited especially for high throughput applications which require WWAN bandwidth aggregation.

SPY-RIG • Octal WWAN Modules Carrier (Photo Soon Here)

Feature Summary

General
  • PICMG® CompactPCI® Serial standard (CPCI-S.0) peripheral slot card
  • Single size Eurocard 3U 4HP 100x160mm2
  • CompactPCI® Serial backplane connector P1
  • Suitable for PCIe® x1 or x2 Gen2 enabled peripheral slots
  • On-board PCIe® packet switch PEX8605

USB Controllers
  • 2 x Texas Instruments PCI Express® to quad-port USB 3.0 controller TUSB7340
  • PCI Express® x 1 Gen2 interface
  • USB 3.0 xHCI (eXtensible host controller interface) SuperSpeed supported
  • USB 2.0 high-speed, full-speed, low-speed supported
  • USB 3.0 & USB 2.0 for M.2 WWAN module sockets
  • USB 2.0 for soldered WWAN modules
  • Drivers available for download

M.2 Sockets
  • 4 x M.2 sockets, for 30mm x 42mm cards, B-key
  • Socket 2 WWAN configuration according to PCI Express M.2 Specification Rev. 1.1 2016
  • USB controlled host I/F, USB 3.0 and USB 2.0
  • Future proof by USB 3.0 SuperSpeed, maximum data rate 5Gbps full duplex
  • Legacy compliant 2G/3G/4G (LTE) by USB 2.0 480Mbps
  • +3.3V power supply, 3.7A typ. current limited electronic power switches, option I2C controlled M.2 socket power on/off
  • F/P Mini SIM card holder associated to each socket (default configuration), 2 x dual-slot
  • Suitable for 25mm x 15mm 2FF UICC, often referred to as 'Standard SIM'
  • Front panel screw lock solution available for Mini SIM cards
  • Analog crosspoint switches provided for SIM card sockets, optional selection between front slots and on-board sockets via I2C programming
  • Front panel LED array associated to M.2 modem LED outputs
  • Common F/P antenna connector SMA for simplified external antenna cabling
  • Custom specific F/P design for additional pigtail antenna connectors (8HP/12HP width)

Soldered WWAN Modules
  • 4 x Telit HE910-GL quad band 3G embedded modules (global use version)
  • DHSPA+ upload 5.76Mbps, download 7.2Mbps
  • UMTS/HSPA MHz 800/850, 900, AWS1700, 1900, 2100
  • On-board Micro SIM card holder associated to each module (default assignment)
  • Analog crosspoint switches provided for SIM card sockets, optional selection between front slots and on-board sockets via I2C programming

R/F Combiner/Splitter Circuit
  • Mini-Circuits SEPS-8-272+, on-board soldering, 8:1
  • 700-2700MHz, 50 Ohm
  • Isolation 20dB typ.
  • Insertion loss 10.8dB typ. 900-2400MHz
  • On-board R/F strapping from M.2 WWAN modules (main antenna connector) to combiner/splitter via e.g. Hirose W.FL or I-PEX MHF4 or Murata HSC (2x2mm2) coaxial connectors and cable assemblies
  • Combiner/splitter bypassing option w. pigtail antenna connectors (custom specific F/P required e.g. 8HP width)
  • On-board R/F routing from soldered WWAN modules to combiner splitter
  • SMA front panel connector 1 (main antenna)
  • Option additional combiner/splitter for 8 x diversity antenna module I/O (7 x EP2W+)
  • Option SMA front panel connector 2 (diversity antenna)

Applications
  • WWAN e.g. 3G/4G/LTE with data transfer rate aggregation
  • Railway, transportation
  • Industrial IoT networking

Regulatory, Environment
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management system
  • Long term availability
  • Rugged solution - coating, sealing, underfilling on request
  • RoHS compliant
  • Operating temperature -40°C to +85°C (industrial temperature range)
  • Storage temperature -40°C to +85°C, max. gradient 5°C/min
  • Humidity 5% ... 95% RH non condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF tbd years (carrier card)
  • EC Regulatory EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)


items are subject to changes

SPY-RIG • Simplified Block Diagram

SPY-RIG • Simplified Block Diagram
Ordering Information
Please refer to List 21 for popular SKUs