AC600 • AC610

Embedded Blue® Boxed Solutions • Intel® Atom™ E3900 Series Processor • Apollo Lake SoC

As a member of their Embedded Blue® DIN Rail series, EKF presents the AC600/AC610, both fully featured industrial PCs. The box is equipped with an Intel® E39xx processor, and offers two connectors each for DisplayPort monitors, USB3 and M12-X Gigabit Ethernet at the front. The AC600/AC610 is provided with 8GB ECC RAM and a PCIe® SSD. The M12 power input connector accepts 9-57VDC. The AC610 has M.2 sockets to accommodate wireless communication modules. Wi-Fi 6 (ax) and Bluetooth are available as well as 5G/LTE WWAN and GNSS. External antennas can be attached via front panel SMA connectors.
The AC600/AC610 is a high reliable solution for industrial environments as well as transportation and railway.

Downloads & Ressources

Documents

Firmware

Firmware Update

Specifications

General

Low Power X86 based boxed PC, for DIN rail mount or wall mount
Intel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable AC600/AC610 versions)
Versatile standard front I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)
Choice of two versions – without (AC600) or with (AC610) wireless networking
SMA/SMA-RP antenna connectors (AC610)
Dimensions: 30mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC600)
Dimensions: 40mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC610)
Metal case, TS35 DIN rail bracket or wall mount plate
M12 power connector
Option terminal block power connector
Option desktop power adapter connector
Wide Range DC power input operation 9-57V

Front Panel I/O

Additional I/O AC610

Processor

Intel® Apollo Lake (APL-I) SoC E39xx Series
x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
Graphics Burst, CPU Burst, Intel® Speedstep®
Intel® Virtualization Technology (Intel® VT-x / VT-d)
Intel® Trusted Execution Engine (Intel® TXE) 3.0

Firmware

Main Memory

Mass Storage

On-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)
Up to 2TB capacity as of current – refer to AC600/610 SKUs
Option front I/O Micro SD Card socket (SDHC, SDXC), available on request
SPI Flash 128Mbit (UEFI firmware and customer application data)
Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)
Option mezzanine storage expansion via P-HSE connector (up to 2 x PCIe®, 1 x USB 3.0)
Option custom specific mezzanine board design on request

Graphics

Networking

Dual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
Two front port M12-X connectors
Option 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)

Wireless Networking AC610

Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)
Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)

APL SoC I/O Usage

2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIe®/SATA)
2 x PCIe® to 2 x I210-IT networking controllers
2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)
1 x USB 3.0 to P-HSE high speed expansion port connector
2 x USB 3.0 to front panel connectors
2 x DisplayPort to front panel connectors
1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
SDIO (Micro SD Card) front panel slot (option, available on request)
LPC to TPM 2.0 module (option)

Building Blocks

Security

Local Expansion

Mezzanine card connectors P-HSE and P-EXP for optional local expansion
P-HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0
Choice of P-HSE based mezzanine I/O or storage modules
AC010 P-HSE based wireless module for Wi-Fi, Bluetooth, WWAN connectivity (AC610)
Custom specific P-HSE based mezzanine module design
Custom specific box design for utilization of P-HSE custom I/O mezzanine modules
Option P-EXP connector – Gigabit Ethernet SerDes I/F derived from I210-IS NIC
Custom specific box design for utilization of P-EXP together with Gigabit Ethernet switch card
Custom specific P-EXP based mezzanine switching module design

Power Requirements

DC Input, 9V-57V (e.g. 12VDC, 24VDC, 48VDC nominal input voltage)
Power consumption 25W max.
Fast acting chip fuse (PCB soldered type – no replacement on-site)
Protected against reverse polarity
ESD protection (TVS)
Common mode input filter
M12-A 5-pin front panel power connector
Option terminal block 3.5mm pitch 4-position screw lock (bottom of box) power input
Option rear power connector (desktop supply 4-pos. circular connector)

Applications

Environmental & Regulatory

Designed & manufactured in Germany
Certified quality management according to ISO 9001
Long term availability
Rugged solution
RoHS compliant
Operating temperature -40°C to +85°C (industrial temperature range) available
Storage temperature -40°C to +85°C, max. gradient 5°C/min
Humidity 5% … 95% RH non condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
Protection class IP20
EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
MTBF tbd years

Simplified Block Diagram

Contact Us

+49 (0)2381/6890-0

AC600 • AC610

Embedded Blue® Boxed Solutions • Intel® Atom™ E3900 Series Processor • Apollo Lake SoC

EKF Elektronik GmbH

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