The PC6-TANGO is equipped with 8GB directly soldered DDR3L ECC RAM, and a CFast™ card socket as on-board SSD mass storage solution..

• CompactPCI^® PlusIO (PICMG^® CPCI 2.30) System Slot Controller
• Form factor single size Eurocard (board dimensions 100x160mm²)
• Mounting height 3U
• Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
• Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
• Backplane communication via CompactPCI^® J1 and J2 hard metric connectors
• J1 Connector for PICMG^® CompactPCI^® 32-Bit Support
• J2 Connector for CompactPCI^® PlusIO support (PCIe, SATA, USB2, GbE)
• J2 PlusIO configuration allows for either CompactPCI^® Serial backplane usage or rear I/O module attachment
• On-board 2 x SATA 6G mezzanine expansion option for mass storage modules or side cards
• Side cards and low profile mass storage modules available as COTS and also as custom specific
• +5V only board design for low cost system power supply
• PC6-TANGO can deliver +3.3V to CompactPCI^® peripheral boards

• Intel^® Apollo Lake (APL-I) SoC E39xx Series
• x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
• x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
• x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
• Graphics Burst, CPU Burst, Intel^® Speedstep^®
• Intel^® Virtualization Technology (Intel^® VT-x / VT-d)
• Intel^® Trusted Execution Engine (Intel^® TXE) 3.0

• Phoenix^® UEFI (Unified Extensible Firmware Interface) with CSM*
• Fully customizable by EKF
• Secure Boot Measured Boot supported - meeting all demands as specified by Microsoft^®
• Windows^®, Linux and other (RT)OS' supported

* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'

• Integrated memory controller up to 8GB DDR3L 1600 +ECC
• Completely soldered memory for rugged applications

• On-board CFast™ Card socket (SATA based CompactFlash)
• Option front I/O Micro SD Card socket (SDHC, SDXC), available on request
• SPI Flash 128Mbit (UEFI firmware and customer application data)
• Option e•MMC (embedded MMC 5.0 64GByte soldered)
• Option low profile mezzanine card C41-CFAST (secondary CFast™ card socket) via P-HSE connector
• Option low profile mezzanine card C42-SATA (1.8-inch Micro SATA SSD socket) via P-HSE connector
• Option low profile mezzanine card C48-M2 (dual M.2 SATA SSD module sockets) via P-HSE connector
• Option 8HP assembly side card PCU-UPTEMPO (dual M.2 SATA SSD module sockets) via P-HSE connector
• Option 8HP assembly side card C44-SATA (2.5-inch SATA SSD/HDD) via P-HSE connector
• Option custom specific mezzanine board design on request

• Integrated HD Graphics Engine, Gen 9 LP
• DirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3
• HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8
• HW video encode H264, SVC, AVC, MVC, MPEG-2
• Content protection PAVP, HDCP 1.4
• 2 x DisplayPort front panel connectors
• DisplayPort™ 1.2a
• Max Resolution 4096 x 2160 @60Hz

• Four networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
• Intel^® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
• IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
• IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
• IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
• Two GbE ports via RJ45 front panel jacks (option 2 x M12-X with mezzanine module P01)
• Two GbE ports via backplane connector

• 4 x PCIe Gen2 to J2 backplane connector - usage for CompactPCI^® Serial peripheral cards or rear I/O module
• 1 x PCIe Gen2 to PCIe switch PI7C9X2G606PR 1:5 lanes (on-board PCIe devices)
• 1 x PCIe to PI7C9X112 PCI bridge (J1 backplane connector, for classic CompactPCI^® card support)
• 1 x SATA 6G to on-board CFast™ SSD card socket - can be used as mass storage and boot device
• 1 x SATA 6G to mezzanine expansion connector P-HSE
• e•MMC I/F 400MByte/s (HS400) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
• 2 x USB 3.0 to front panel connectors
• 2 x DisplayPort to front panel connectors
• SDIO (Micro SD Card) front panel slot (option, available on request)
• 4 x USB2 to J2 backplane connector
• LPC, Audio, I2C, 2 x USB2 to mezzanine expansion connector P-EXP
• LPC to TPM 2.0 module

• Additional on-board controllers, PCIe^® based
• PCIe^® Gen2 packet switch PI7C9X2G606PR (6-port, 6-lane)
• 2 x Gigabit Ethernet controllers Intel^® I210IT (front panel)
• 2 x Intel^® I210IT (RIO via J2 backplane connector)
• PCIe^® to PCI^® bridge PI7C9X112 (7 x PCI 33/66MHz)
• PCIe^® Gen2 packet switch PLX 8608
• Dual port SATA 6G/3G* controller Marvell^® 88SE9170 (to P-HSE mezzanine connector, and J2 RIO)
• Option e•MMC (embedded MMC 5.0 64GByte HS400)

• Trusted Platform Module
• TPM 2.0 for highest level of certified platform protection
• Infineon Optiga™ SLB 9665 cryptographic processor
• Conforming to TCG 2.0 specification

• AES hardware acceleration support (Intel^® AES-NI)

• 2 x Gigabit Ethernet RJ45 (2 x I210IT)
• 2 x DisplayPort (APL SoC)
• 2 x USB 3.0 Type-A (APL SoC)

• Option RS-232, Audio, USB w. PCU-UPTEMPO side card
• Option 2 x M12 X-coded receptacles for Gigabit Ethernet (as replacement for RJ45)
• Custom specific front panel and side card design

• PICMG^® CompactPCI^® 2.0 CPU card & system slot controller for J1 based 32-bit CompactPCI^® systems
• Support for up to seven CompactPCI^® peripheral boards, 33/66MHz (PI7C9X112 PCIe to PCI bridge)
• PICMG^® CompactPCI^® 2.30 J2 connector pin assignment according to CompactPCI^® PlusIO
• J2 can be used to enable CompactPCI^® Serial peripheral card slots for hybrid systems with a split backplane
• J2 can be used alternatively for a rear I/O module
• J2 is assigned to 4 x PCIe Gen2 5GT/s (from APL SoC), 1 x SATA 3G * (from Marvell SATA controller), 4 x USB2 ports (from APL SoC), 2 x Gigabit Ethernet (I210IT networking controllers)

• Mezzanine side card connectors for optional local expansion
• P-EXP - LPC, Audio, 2 x USB2, I2C (from APL SoC)
• P-HSE - 2 x SATA 6G (port 1 from APL SoC, port 2 from PCIe to SATA controller 88SE9170)

• 4HP Low profile mezzanine module options (to be ordered separately)
• CFast™ Card with C41-CFAST mezzanine module
• SATA 1.8-Inch Solid State Drive with C42-SATA mezzanine module
• Dual M.2/NGFF SATA SSD 2230 - 2280 size with C48-M2 mezzanine module
• Custom specific module design

• 8HP Mezzanine side card option (to be ordered separately)
• PCU-UPTEMPO side board w. 2 x M.2 SATA sockets & front I/O
• 2.5-inch SATA SSD/HDD available with C44-SATA
• Custom specific side card design

• Designed & manufactured in Germany
• ISO 9001 certified quality management
• Long term availability
• Rugged solution
• Coating, sealing, underfilling on request
• Lifetime application support
• RoHS compliant 2002/95/EC
• EC Regulatory EN55024, EN55032, EN62368-1
• Operating temperature -40°C to +85°C (industrial temperature range)
• Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
• Humidity 5% ... 95% RH non Condensing
• Altitude -300m ... +3000m
• Shock 15g 0.33ms, 6g 6ms
• Vibration 1g 5-2000Hz
• MTBF 21.6 years

• Please refer to external document 'RTOS Support' (PDF)

• General low power industrial computing, ready for x86 based software
• Rugged systems (e.g. transportation)
• Data concentrator, router, gateway, kiosk systems, IIoT
• Stand-alone computer (fog computing), scalable via mezzanine I/O expansion options
• Small modular CompactPCI^® PlusIO systems for expansion with up to four peripheral cards