EKF - Short Profile
EKF - Short Profile


Low Profile Mezzanine for CompactPCI® Serial CPU Cards
M.2 NVMe SSD Storage

8-Port Gigabit Ethernet Backplane Support

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Technical Information

Block Diagram

Mezzanine Connectors

General Information

All You Need to Know

S80-P6 • Low Profile Mezzanine Module • M.2 NVME SSD & GbE Switch
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Low Profile Mezzanine Card for CPU Boards

M.2 SSD (NVMe PCIe x4 Gen3)
Gigabit Ethernet Switching over Backplane (8-Port Star/Mesh)

Available as a mezzanine add-on expansion board e.g. to the SC5-FESTIVAL and successor CPU carrier cards, the main purpose of the S80-P6 is to provide a Solid State Drive mass storage solution, and in addition to supply the backplane with eight Gigabit Ethernet ports.

The S80-P6 is equipped with an M.2 PCIe x4 socket, suitable for a high speed NVMe type SSD module, with a maximum capacity of 2TB as of current, sufficient for installation of an operating system and also data storage.

A nine-port Gigabit Ethernet switch is provided on-board. Eight ports are available for CompactPCI® Serial backplane communication via the P6 connector. Another port is connected to the local GbE controller.

The Gigabit Ethernet switch provides latest features such as 802.1 Audio Video Bridging (AVB/TSN) and Quality of Service (QoS) support, and allows light in-band managment.

Ethernet is the preferred interface for a multiprocessing configuration. With a suitable Ethernet enabled CompactPCI® Serial backplane, both networking architectures are supported, either single star for reasonable backplane cost, or full mesh for optimum system flexibility.

The S80-P6 connects to the mezzanine expansion connectors HSE1 and HSE2 of the CompactPCI® Serial CPU carrier board, maintaining the 4HP (20.32mm) total assembly height.

S80-P6 • Low Profile Mezzanine Module • M.2 NVMe SSD and GbE Switch

S80-P6 • Low Profile Mezzanine Module

The S80-P6 is equipped with a Marvell® 88E6390 Gigabit Ethernet switch as its main component. This device provides eight PHY ports (1-8) with integrated Gigabit Ethernet transceivers, which are wired across magnetics modules to the CompactPCI® Serial backplane connector P6.

In addition, a SerDes port (9) of the switch is connected internally to the Intel® I210-IS on-board Gigabit Ethernet controller, for switch access by the CPU card (PCI Express®).

The CPU carrier card with the S80-P6 mezzanine typically would be inserted into the system slot of a CompactPCI® Serial backplane, suitable for either star architecture networking, or full mesh backplane Ethernet. Both structures allow backplane multiprocessing and other Ethernet bound communication over P6/J6 between CompactPCI® Serial boards, with higher flexibility (and backplane cost) offered by the mesh version. An alternative application would be rear I/O Ethernet across P6 (this requires a rear I/O enabled backplane slot).

Feature Summary

Form Factor
  • Proprietary size mezzanine module
  • Fits basically into the 4HP (20.3mm) envelope of the CPU carrier board
  • Typically delivered as a ready to use assembly unit (including SC4-CONCERTO or successor CPU card)
  • Mounting position right (on top of a CPU board)

Host I/F Connectors HSE1/HSE2
  • High speed mezzanine connectors
  • Suitable for PCI Express® Gen3
  • Bottom mount male connectors HSE1 and HSE2 (high speed expansion)
  • Mating with the carrier card female connectors HSE1/2
  • Board-to-board height 10.8mm for a 4HP assembly
  • PCI Express® x4 support (dedicated to the NVMe SSD module M.2 socket
  • Power sourcing 12V/1.5 A maximum continuous current (2 pins)
  • PCI Express® support (dedicated to the PCIe x1 based on-board Gigabit Ethernet controller)
  • Power sourcing 12V/3.0 A maximum continuous current (4 pins)

M.2 NVMe Module Connector
  • Single M.2 socket, maximum M.2 size 2280 (M.2 formerly known as NGFF)
  • Suitable for M.2 NVMe SSD module, key Id M, PCIe x4 I/F
  • PCIe® 1x4 sourced via HSE1 mezzanine connector
  • Maximum (theoretical) 32Gbps I/O data transfer rate (Gen3 PCIe 8GT/s)
  • Power switch, undervoltage lockout, short-circuit protection, quick discharge
  • Module dimensions 2230/2242/2260/2280, screw fixed
  • Module height (Label) S1-S5

Gigabit Ethernet Switch
  • Marvell® 88E6390 based Gigabit Ethernet switch (in use 8 x GbE MAC/PHY 1000BASE-T, 1 x GbE MAC SerDes)
  • Eight GbE ports wired to the backplane connector P6 (isolated by magmods)
  • High performance, non-blocking, Gigabit Ethernet
  • Support for up to 16K MAC addresses, 10KByte Jumbo Frames
  • Supports 802.1 Audio Video Bridging (AVB) Gen 2
  • Time Sensitive Networking (TSN) Standards, IEEE 1588v2 one-step PTP
  • Synchronous Ethernet
  • Quality of Service (QoS) support with 8 traffic classes
  • Supports 4096 802.1Q VLANs, three levels of 802.1Q security
  • Unmanaged or managed solution
  • Integrated microprocessor (IMP) enables enhanced managed switch designs (customer programming)
  • IMP GUI debugger w. ANSI C compiler & assembler available on request from Marvell®
  • Remote (in-band) management available on request via Marvell® SOHO Switch GUI Software
  • Configurable in-band management through SerDes switch port (connected to the optional on-board NIC), or GbE PHY switch port via P6 backplane Ethernet (1_ETH)

Gigabit Ethernet Controller
  • Intel® I210-IS Gigabit Ethernet controller internally wired to the GbE switch port 9 via SerDes
  • 9.5KB Jumbo Frame support
  • Hardware-based time stamping (IEEE 1588) and support for 802.1AS
  • IEEE 802.1Qav compliant Audio-Video Bridging (AVB)
  • IPv4, IPv6, TCP/UDP checksum offloads
  • Based on PCI Expess® x1 derived from the mezzanine connector HSE2
  • Driver support for all major operating systems

  • Low profile mezzanine module for EKF CPU Cards (SC4-CONCERTO and later)
  • 4HP assembly CPU carrier board and S80-P6 mezzanine card
  • Adds SSD mass storage and backplane Ethernet networking to the CPU carrier
  • M.2 based mass storage, 1 x M.2 PCIe x4 socket (NVMe)
  • On-board GbE switch for backplane communication and multiprocessing via backplane connector P6, eight GbE ports (suitable for single star architecture or full mesh or RIO)

Environmental & Regulatory
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management
  • Long term availability
  • Rugged solution
  • Coating, sealing, underfilling on request
  • Lifetime application support
  • RoHS compliant
  • Operating temperature 0°C to +70°C
  • Operating temperature -40°C to +85°C (industrial temperature range) on request
  • Storage temperature -40°C to +85°C, max. gradient 5°C/min
  • Humidity 5% ... 95% RH non condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF 50.3 years (MIL-HDBK-217F, SN29500 @+40°C)
  • EC Regulatory EN55035, EN55032, EN62368-1 (CE)

S80-P6 • Simplified Block Diagram

S80-P6 • Simplified Block Diagram

S80-P6 Low Profile Mezzanine Module

S80-P6 Low Profile Mezzanine Module
Ordering Information
Please refer to List 21 for popular S80-P6 SKUs
EKF is an ISO-9001 certified company
EKF Elektronik GmbH • Philipp-Reis-Str. 4 • 59065 Hamm • Germany
Phone +49 (0)2381/6890-0 • Fax +49 (0)2381/6890-90 • E-Mail