EKF - Short Profile
EKF - Short Profile

Low Profile Mezzanine Module for CompactPCI® Serial CPU Cards

M.2 NVMe SSD PCI Express® Gen4 • 4 x 2.5GBASE-T Backplane Ethernet • Type-C Front I/O



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S83-P6 • CPU Mezzanine Module

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Low Profile Mezzanine Card for CPU Boards

M.2 SSD PCIe® up to Gen4 • Quad 2.5GBASE-T Backplane Ethernet • Type-C Front I/O

Available as a mezzanine add-on expansion board e.g. to the SC5-FESTIVAL and successor CPU carrier cards, the main purpose of the S83-P6 is to provide a Solid State Drive mass storage solution, and in addition to supply the backplane with four Gigabit Ethernet ports.

The S83-P6 is equipped with an M.2 PCIe® Gen4 x4 socket, suitable for an NVMe type SSD module. The maximum PCIe® data transfer rate depends on the particular CPU carrier card (16GT/s require SC9-TOCCATA).

Four discrete Gigabit Ethernet controllers are provided on-board, for CompactPCI® Serial backplane communication via the P6 connector according to the 2.5GBASE-T interface standard.

The S83-P6 is equipped in addition with a Type-C front port for attachment of an USB device or DisplayPort monitor.

The Intel® I226-IT 2.5GbE controllers support latest networking features and are backward compatible to 1000BASE-T as originally specified by the CompactPCI® Serial specification. With a suitable Ethernet enabled CompactPCI® Serial backplane, both networking architectures are supported, either single star or full mesh.

The S83-P6 connects to the mezzanine expansion connectors HSE1 and HSE2 of the CompactPCI® Serial CPU carrier board, maintaining the 4HP (20.32mm) total assembly height.

S83-P6 • Low Profile CPU Mezzanine Module

S83-P6 over CPU Carrier Card

Feature Summary

  Form Factor
  • Proprietary size mezzanine module - low profile
  • Fits basically into the 4HP (20.32mm) envelope of the CPU carrier board
  • Typically delivered as a ready to use assembly unit (including CPU card)
  • Mounting position right (on top of a CPU board)

  Eligible CPU Carrier Cards

  M.2 Module Connector
  • Single M.2 socket, maximum M.2 SSD size 2280 (M.2 formerly known as NGFF)
  • Suitable for M.2 NVMe SSD module, key Id M, PCIe® x4 I/F
  • Autosense option for SATA SSD (depends on carrier card)
  • PCIe® x4 up to Gen4 sourced via HSE1 mezzanine connector
  • Maximum (theoretical) 64Gbps I/O data transfer rate (Gen4 PCIe 16GT/s)
  • Module dimensions 2230/2242/2260/2280, screw fixed (2280 w. locking bar)
  • M.2 Module height (Label) S3 - top side component height 1.5mm max., no bottom side components
  • Module 3.3V power DC/DC regulator can be switched off/on via I2C (BIOS settings)

  Type-C Front I/O
  • USB 3.2 Gen1/2 (5G/10G) depending on CPU carrier card in use
  • DP Alt Mode (DisplayPort 1.2/1.4a MST depending on CPU carrier card)
  • VBUS power DC/DC regulator can be switched off/on via I2C (BIOS settings)

  P6 CompactPCI® Serial Backplane Connector
  • 4 x 2.5GBASE-T, individual I226-IT NICs
  • Backward compatible to 1000BASE-T CompactPCI® Serial cards
  • For use with Ethernet enabled backplanes (equipped w. J6 connector)
  • Suitable for Star and Mesh Ethernet configured backplanes
  • Suitable for a rear I/O Ethernet module

  Host I/F Connectors
  • High speed mezzanine connectors
  • Suitable for PCI Express® Gen3/4, USB 5G/10G, DisplayPort
  • Bottom mount male connectors HSE1 and HSE2 (high speed expansion)
  • Mating with the corresponding carrier card female connectors HSE1/2
  • Board-to-board height 10.8mm for a 4HP assembly


  • PCI Express® 1x4 support (dedicated to the NVMe SSD module M.2 socket)
  • PCIe® Gen4 supported (depends on carrier card)
  • USB3 up to 10Gbps support (dedicated to the optional Type-C USB front panel connector)
  • SATA supported (assigned to the M.2 SSD socket, depends on carrier card)
  • Power sourcing 12V/1.5 A maximum continuous current (2 pins)


  • PCI Express® 4x1 support (dedicated to the PCIe® based on-board Gigabit Ethernet controllers)
  • DisplayPort (for Type-C DP Alt Mode, depends on CPU carrier board)
  • Power sourcing 12V/3.0 A maximum continuous current (4 pins)

  Gigabit Ethernet NICs
  • Four individual Intel® I225/226-IT networking interface controllers (NIC)
  • 2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T 802.3 specifications
  • -40°C to +85°C operating temperature 10M/100M/1G
  • -40°C to +70°C operating temperature 2.5G (I225)
  • -40°C to +85°C operating temperature 2.5G (I226)
  • UDP, TCP and IP checksum offload
  • 9KB Jumbo Frame support
  • Four transmit and four receive queues
  • IEEE 802.3az Energy Efficient Ethernet
  • Ultra-low power at cable disconnect (5mW)
  • Time Sensitive Networking (TSN)
  • IEEE 1588 - Basic time-sync (Precision Time Protocol)
  • IEEE 802.1AS-Rev - Higher precision time synchronization with multiple (dual) clock masters
  • IEEE 802.1Qav - Credit Based Shaping and Basic scheduling
  • IEEE 802.1Qbu - Frame Preemption
  • IEEE 802.1Qbv - Time Aware Shaper
  • IEEE 802.3br - Interspersing Express Traffic
  • PCIe® PTM for synchronization between the NIC and Host timers
  • Based on four PCI Expess® x1 links derived from the mezzanine connector HSE2
  • Driver support for all major operating systems
  • DC/DC power regulator for Ethernet NICs can be switched off/on via I2C (BIOS settings)

  • Low profile mezzanine module for EKF CPU Cards (SC5-FESTIVAL and later)
  • 4HP assembly CPU carrier board and S83-P6 mezzanine card
  • Adds SSD mass storage and backplane Ethernet networking to the CPU carrier
  • M.2 based mass storage, 1 x M.2 PCIe x4 socket (NVMe)
  • On-board 2.5GbE NICs for backplane communication and multiprocessing via backplane connector P6, four GbE ports (suitable for single star architecture or full mesh or RIO)
  • Additional monitor via Type-C DP Alt Mode

  Environment & Regulatory
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management
  • Long term availability
  • Rugged solution
  • Coating, sealing, underfilling on request
  • Lifetime application support
  • RoHS compliant
  • Operating temperature -40°C to +85°C industrial temperature range
  • Storage temperature -40°C to +85°C, max. gradient 5°C/min
  • Humidity 5% ... 95% RH non condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • EC Regulatory EN55035, EN55032, EN62368-1 (CE)
  • MTBF 58.1 years (MIL-HDBK-217F, SN29500 @+40°C)

S83-P6 • Low Profile Mezzanine Module

S83-P6 • Low Profile Mezzanine Module

S83-P6 • Simplified Block Diagram

S83-P6 • Simplified Block Diagram
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